Laser Ball Jetting Machine ndi makina opangira makina otsatizanatsatizana a laser, omwe amathandiza pazida zosiyanasiyana za ma microelectronic, makamaka odzipatulira ma module a kamera, masensa, okamba a TWS ndi zida zamagetsi.
Dongosololi limatha kuyimitsa ndikuyikanso mipira yogulitsira ndi m'mimba mwake pakati pa 300 µm ndi 2000 µm, liwiro la soldering ndi pafupifupi mipira 3 ~ 5 pamphindikati.
Imagwiritsidwa ntchito ku soldering ya mpira wa zinthu monga Camera Modules, BGA re-balling, wafers, optoelectronic products, sensors, TWS speaker, FPC to rigid pcb ... etc.